Autoflex Loader Live at Pack Expo 2008 in Chicago
Date: 11/9/2008
Location: McCormick Centre, Chicago, IL
Recent advances in robotics, vision guidance, and control
technology have resulted in a new wave of Agile Packaging Solutions, now available for food and consumer goods manufacturers to remove bottlenecks, improve upstream equipment efficiency, and automate repetitive or challenging non-value added manual tasks. JMP Engineering will be showcasing one of these ground-breaking Agile Packaging Solutions live at Pack Expo in Chicago from November 9-13, 2008. Presented in partnership with Motoman (booth #S-1594), manufacturers will be able to able to see first hand how this new solution could automate their secondary packaging process with a 12 – 18 month return on investment.
Pack Expo International is the one show this year that can solve all of your packaging challenges. Check out the latest innovations spanning the entire packaging supply chain:
Packaging and Processing Machinery
Containers
Materials
Services
Components
Converting Machinery and More
Discover ways to cut costs and increase productivity. Explore the newest technologies. Network with other packaging professionals—all under one roof. For more information and to register go to the Pack Expo website. http://pei2008.packexpo.com/
